Customization: | Available |
---|---|
Structure: | Multilayer Rigid PCB |
Dielectric: | FR-4 |
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Materials |
Polyimide / FR4 |
Thinnest Core |
50um without Adhesive |
Copper Thickness |
9um / 12um / 18um / 35um |
Copper Plating Holes |
20um (25um) |
Min. Line / Spacing |
125um / 125um |
Soldermask Registration |
+/- 100um (Photoimageable) |
Min. Soldermask Dam |
100um |
Soldermask Color |
Amber (green) |
Cover Layer Polyimide |
Laser cutting / punching / drilled |
Production Panel |
609.6 mm x 457.2 mm 250 mm x (250 - 410 mm) |
Min. Annular Ring |
150um |
Smallest Drill |
0.28 mm |
Smallest Routing Bit |
0.8 mm |
Surfaces |
OSP / Immersion Tin Immersion Ni/Au Plated Ni/Au |
ID Print |
White |
Adhesive Tape |
Yes |
SMT Service |
Yes |
Stiffner Material |
FR4 / Steel / Aluminium |
PCB Prototype Lead Time: | ||
item | General time | Quick Turn |
1-2 | 4 days | 1 days |
4-6 Layers | 6 days | 2 days |
8-10 Layers | 8 days | 3 days |
12-16 Layers | 12 days | 4days |
18-20 Layers | 14 days | 5 days |
22-26 Layers | 16 days | 6 days |
Note: Base on all data received by us and must be complete and problem free, Lead time is ready to ship time. |