| Structure: | Multilayer Rigid PCB |
|---|---|
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | HB |
| Processing Technology: | Electrolytic Foil, Delay Pressure Foil |
| Customization: |
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