OEM ODM Ultrasonic Humidifier Motherboard PCBA High Precision PCB Circuit Board with Smart Temperature & Humidity Control Home Commercial Use PCBA SMT Factory
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Product Details
| Customization: | Available |
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| Metal Coating: | Copper |
| Mode of Production: | SMT |
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| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
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Basic Info.
- Layers
- Multilayer
- Base Material
- FR-4
- Certification
- RoHS, CCC, ISO
- Customized
- Customized
- Condition
- New
- Board Material
- Fr4
- Board Thickness
- 1.6mm
- Copper Thickness
- 1oz
- Surface Treatment
- Immersion Gold
- Soldermask
- Green, Blue, White, Red, Black, etc.
- Silkscreen
- Green, Blue, White, Red, Black, etc.
- Mini Holes
- 0.1mm
- Mini Trace
- 3 Mil/ 3 Mil
- MOQ
- 1PCS
- Test
- 100%
- Service
- One-Stop
- Supply
- Fast
- File
- PCB File
- Lead Time
- 5-6 Days
- Delivery
- DHL, FedEx, UPS, etc.
- Transport Package
- Vacuum+Carton Packing
- Specification
- UL, SGS, ROHS
- Trademark
- Fastline
- Origin
- China
- HS Code
- 853400900
- Production Capacity
- 20000square Meter/Mon
Packaging & Delivery
- Package Size
- 15.00cm * 20.00cm * 35.00cm
- Package Gross Weight
- 5.000kg
Product Description
OEM ODM Ultrasonic Humidifier Motherboard PCBA High Precision PCB Circuit Board with Smart Temperature & Humidity Control Home Commercial Use PCBA SMT Factory
| PCB Max. size | DIP capacity |
| Min component size | 0201 |
| Min.pin space of IC | 0.3mm |
| Min. space of BGA | 0.3mm |
| Max.precision of IC assembly | ±0.03mm |
| SMT capacity | ≥2 million points/day |
| DIP capacity | ≥100k parts/day |
What we can do?
| SMT(Surface Mounting technology),DIP. |
| 1. Material Sourcing Service |
| 2. SMT assembly and Through hole components insertion |
| 3.100% AOI testing |
| 4. IC pre-programming / Burning on-line |
| 5.ICT testing |
| 6.Function testing as requested |
| 7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
| 8.Conformal coating |
| 9.OEM/ODM also welcomed |


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