| Customization: | Available |
|---|---|
| Board Thickness: | 1.6mm Rigid and 0.1mm Flex |
| Copper Thickness: | 1oz |
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PCB Manufacture Capability |
|
| Item | Manufacture Capability |
| Layers | 1-26 Layers |
| HDI | 2+N+2 |
| Material Types | Fr-4, Fr-5, High-Tg, Aluminum Based , Halogen Free, |
| Isola, Taconic, Arlon, Teflon, Rogers, | |
| Max. Panel Dimension | 39000mil * 47000mil (1000mm * 1200mm) |
| Outline Tolerance | ± 4mil (± 0.10mm) |
| Board Thickness | 8mil-236mil (0.2 - 6.0mm) |
| Board Thickness Tolerance | ± 10% |
| Dielectric Thickness | 3mil-8mil ( 0.075mm-0.20mm) |
| Min. Track Width | 3mil ( 0.075mm ) |
| Min. Track Space | 3mil ( 0.075mm ) |
| External Cu Thickness | 0.5 OZ - 10 OZ ( 17um - 350um) |
| Internal Cu Thickness | 0.5OZ - 6OZ ( 17um - 210um) |
| Drilling Bit Size ( CNC ) | 6mil-256mil ( 0.15mm - 6.50mm) |
| Finished Hole Dimension | 4mil-236mil(0.1mm - 6.0mm) |
| Hole Tolerance | ± 2mil (± 0.05mm) |
| Laser Drilling Hole Size | 4mil(0.1mm) |
| Aspect Ration | 16: 1 |
| Solder Mask | Green, Blue, White, Black, Red, Yellow, Purple, etc. |
| Min Solder mask Bridge | 2mil(0.050mm) |
| Plugged Hole Diameter | 8mil-20mil ( 0.20mm-0.50mm) |
| Beveling | 30o - 45o |
| V-scoring | +/-0.1mm, 15o 30o 45o 60o |
| Impedance Control | Min. 5% General ± 10% |
| Surface Finishing | HASL, HASL(lead Free), Immersion Gold |
| Immersion Silver, OSP, Hard Gold ( up to 100u" ) | |
| Certification | UL RoHS ISO9001: 2000 ISO14000: 2004 SGS |
| Testing | Flying probe, E-TEST, X-RAY Inspection , AOI |
| Files | Gerber Protel DXP Auto CAD PADS OrCAD Express PCB etc |
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