Customization: | Available |
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Insulation Materials: | Epoxy Resin |
Flame Retardant Properties: | V0 |
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Size of Rigid-Flexible PCB | 60.5 X 58mm |
Number of Layers | 2 |
Board Type | Rigid-Flexible PCB |
Board Thickness | 0.10mm |
Board Material | Polyimide 25µm |
Board Material Supplier | Shengyi |
Tg Value of Board Material | 60ºC |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | N/A |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | NO |
Stiffener Thickness | N/A |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |