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High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

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  • 14 yrs

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Product Highlights

  • Thick Copper Layer: Supports copper thickness up to 4oz for high-current applications.
  • Efficient Heat Dissipation: Designed for efficient heat dissipation in drone and portable devices.
  • Lightweight Design: Lightweight structure suitable for drones and portable electronics.
  • Wide Layer Options: Available in 1 to 30 layers with flexible customization.
  • Low MOQ: Minimum order quantity as low as 1 piece for prototyping.
  • 100% Testing: Every board undergoes 100% electrical testing for quality assurance.
  • Multiple Surface Finishes: Options include HASL, Immersion Gold, OSP, and more.
  • Fast Lead Time: Standard lead time of 6-8 working days for production.

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Clearer shipment tracking with platform-supported logistics.
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Optional pre-shipment inspection for quality and quantity checks.
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Platform-assisted dispute resolution, including refunds or returns when applicable.

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Product Images of High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight pictures & photos
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
  • High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
    High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

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Product Description

High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight


High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight


Product Description
                                                 Fastline  PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction



 
ITEM(PCB) Capability(PCB)
Layers 1--28
Copper thickness 1--6OZ
Base material FR4(Shengyi China,ITEQ,KB A+,HZ),HI-TG, FR06,
Rogers, Taconic,Argon,Nalco,Isola and so on
Finished surface conventional hasl,  lead free hasl, immersion gold, immersion tin,
immersion silver, hard gold, OSP...
Soldermask green, black, yellow, white, blue, red......
Finished board thickness 0.2-7.0mm
Board thickness tolerance Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%

Product showcase:
High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight



High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

Product process:


High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight


Products Equipment

High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight

RFQ:

Q: Are you trading company or manufacturer ?
A: We are factory.

Q: What is your MOQ?
A: We could produce even 1pc for you.

Q: What you need if pcba inquiry ?
A: Normally pls offer PCB gerber file and BOM list.If you do not have both and only the idea,we could also develop for you.

Q: What is your terms of payment ?
A: Payment by Paypal, Wester union,T/T or trade assurance all are ok for us.

 

Please feel free to contact us

 

 
 


 

 


 

About the Supplier

This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR232482". Items marked "verified" are certified.

Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited
Fastline Circuits Co., Limited

About Our Factory & Business Background

Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
verified Plant Area
580 square meters
verified Registered Capital
1,000,000 RMB
verified Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment
verified International Commercial Terms(Incoterms)
FOB, CIF, DDP, FCA, EXW
verified Average Lead Time
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
verified Nearest Port
Shenzhen Port, Hong Kong Port, Guangzhou Port

Our Production Capability & Technical Expertise

Main Products
Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, PCB Board, LED PCB, Circuit Board, PCB
verified R&D Engineers
2 people

Our Industry Experience & Global Business Record

verified Year of Establishment
2006-09-21
Export Year
2004-10-04
verified Main Markets
North America, South America, Europe, Southeast Asia/ Mideast
verified Number of Foreign Trading Staff
8
verified Overseas Agent/Branch
No

FAQ

Are you a trading company or manufacturer?
We are a factory.
What is your MOQ?
We could produce even 1pc for you.
What information is needed for a PCBA inquiry?
Normally pls offer PCB gerber file and BOM list.If you do not have both and only the idea,we could also develop for you.
What are your terms of payment?
Payment by Paypal, Wester union,T/T or trade assurance all are ok for us.
What is the maximum copper thickness available?
The copper thickness can go up to 4oz.
What is the standard lead time for production?
The lead time is 6-8 working days.
Is 100% testing performed on the boards?
Yes, 100% testing is included.

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