| Type: | PCBA |
|---|---|
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy |
| Flame Retardant Properties: | V1 |
| Mechanical Rigid: | Rigid |
| Processing Technology: | Electrolytic Foil |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier | Size of FR4 PCBA | 60.22 X 132.27mm |
| Number of Layers | 4 |
| Board Type | FR4 PCB |
| Board Thickness | 1.6mm |
| Board Material | FR-4 1.6mm / Polyimide 25µm |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow Coverlayer / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}