Solving Thermal and Power Density Challenges in Automotive and Power Electronics Multilayers Flex Circuit PCB Manufacturer
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| Customization: | Available |
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| Structure: | Multilayer FPC |
| Material: | Polyimide |
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Basic Info.
- Model NO.
- FLCA-Q001
- Combination Mode
- Adhesive Flexible Plate
- Application
- Digital Products
- Conductive Adhesive
- Anisotropic Conductive Adhesive
- Flame Retardant Properties
- V0
- Processing Technology
- Electrolytic Foil
- Base Material
- Fr4
- Insulation Materials
- Epoxy Resin
- Board Thickness
- 1.6mm
- Board Layer
- 2 Layers
- Copper Thickness
- 1 Oz
- Solder Mask
- Green
- Silksreen
- White
- Surface Finihsing
- HASL-Lf
- Lead Time
- 6-8 Working Days
- PCB Design
- Custom Design Product
- Shipping Type
- DHL.TNT, EMS, FedEx, UPS etc
- Board Material
- Fr4
- Transport Package
- Vacuum+Carton Packing
- Specification
- RoHS, ISO9001, UL, SGS
- Trademark
- FL
- Origin
- Shenzhen, China
- HS Code
- 8534009000
- Production Capacity
- 20000 Square Meter/Mon
Packaging & Delivery
- Package Size
- 36.00cm * 15.00cm * 16.00cm
- Package Gross Weight
- 1.000kg
Product Description
Quick Turn Rigid-Flex Board Manufacturing
Dear buyer,
Thank you for scanning our website about FPC.
As is known,PCB is customized product ,so the unit price is not real,details please contact me and a quotation will be offered.Please send us PCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd" .
Product Description
Standard Flex Materials:
Polyimide (Kapton) : 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material : 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. - .00047 in. (.012mm)--rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks
Flex PCB Capability
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Fastline Circuits Co., Limited |
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FPC Technology and Capabilities |
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Material |
FR4,Polyimide / Polyester |
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Counts |
Flex: 1~8L; Rigid-Flex: 2~8L |
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Board Thickness |
Min.0.05mm ; Max. 0.3mm |
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Copper Thickness |
1/3 oz --- 2 oz |
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CNC Drill Size (Max) |
6.5mm |
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CNC Drill Size (Min) |
Flex: 0.15mm |
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Holes Location Tolerance |
±0.05mm |
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Coverlay Drill Size (Min) |
0.6mm |
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Hole to Coverlay Opening Windows (Min) |
0.15mm |
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Min Line Width / Spacing |
0.1/0.1mm |
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Copper Thickness on Hole Wall |
Flex:12-22μm |
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Min Pad Size |
φ0.2mm |
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Etch Tolerance |
Finished line width tolerance ±20% |
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Pattern Registration Tolerance |
±0.1mm (Working Panel Size: 250*300mm) |
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Coverlay Registration Tolerance |
±0.15mm |
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Solder Mask Registration Tolerance |
±0.2mm |
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Solder Mask to PAD |
Non photosensitive: 0.2mm |
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Photosensitive: 0.1mm |
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Min. Solder Mask Dam |
0.1mm |
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Misregistration Tolerance |
±0.30mm |
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for Stiffener, Adhesive, Glue paper |
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Surface Finish |
Plating Ni / Au ; Chemical Ni / Au ; OSP |
Would like to know more about the product? Send us inquiry, click "Send" now!
Please feel free to send us gerber file for lastest price and discount!
Contact Person:Grace Zhou
Web:fastlinepcb.en.made-in-china.com
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