Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss

Product Details
Customization: Available
Type: Aluminium PCB
Flame Retardant Properties: V0
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
  • Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
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Basic Info.

Model NO.
FL085
Dielectric
Aluminium Base PCB
Base Material
Aluminum
Insulation Materials
Organic Resin
Processing Technology
Delay Pressure Foil
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Aluminum
Board Material
Aluminum
Board Layer
1
Board Thickness
1.0 Mm
Copper Thickness
2 Oz
Min. Hole Size
0.20 Mm
Min Line Width&Space
0.15 Mm
Solder Mask
White/Black
Silksreen
Black/ White
Surface Fnishing
OSP
Lead Time
5-6 Working Days
Transport Package
Vacuum+Carton Packing
Specification
RoHS, ISO9001, UL, SGS
Trademark
FL
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000square Meter/Mon

Packaging & Delivery

Package Size
36.00cm * 15.00cm * 16.00cm
Package Gross Weight
1.000kg

Product Description

Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss

50 layer HDI PCB, multilayer PCB with ENIG PCB Factory Offers Multilayer PCB Circuit Boards

Features-Our Products Advantage 
 
1. Over 10 years experience manufacturer in PCBA service field.
 
2.  Big scale of producing makes sure that your purchase cost is lower.
 
3. Advanced production line guarantees stable quality and long life span.
 
4. Design and produce almost any PCB as your requirement.
 
5. 100% test for all customized pcb products 
 
6. One-stop Service ,we can help to purchase the compnents



Can we see other PCBs? 

Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss


 

Can we know your factory PCB manufacture capability?

 

PCB  Manufacture  Capability
Item    Manufacture  Capability
Layers    1-26  Layers
HDI  2+N+2
Material  Types  Fr-4,   Fr-5,   High-Tg,   Aluminum  Based  , Halogen  Free,                                                                                              
Isola,   Taconic,   Arlon,   Teflon,   Rogers,  
Max.   Panel  Dimension 39000mil  *  47000mil  (1000mm  *  1200mm)
Outline  Tolerance  ± 4mil  (± 0.10mm)
Board  Thickness 8mil-236mil  (0.2  -  6.0mm)   
Board  Thickness  Tolerance  ± 10%
Dielectric  Thickness  3mil-8mil  (  0.075mm-0.20mm)
Min.   Track  Width  3mil  (  0.075mm  )
Min.   Track  Space 3mil  (  0.075mm  )
External  Cu  Thickness  0.5  OZ  -  10  OZ  (  17um  -  350um)
Internal  Cu  Thickness    0.5OZ  -  6OZ  (  17um  -  210um)
Drilling  Bit  Size  (  CNC  )  6mil-256mil  (  0.15mm  -  6.50mm)
Finished  Hole  Dimension        4mil-236mil(0.1mm  -  6.0mm)
Hole  Tolerance ± 2mil  (± 0.05mm)
Laser  Drilling  Hole  Size    4mil(0.1mm)
Aspect  Ration  16: 1
Solder  Mask Green,   Blue,   White,   Black,   Red,   Yellow,   Purple,   etc.
Min  Solder  mask  Bridge 2mil(0.050mm)
Plugged  Hole  Diameter 8mil-20mil  (  0.20mm-0.50mm)
Beveling 30o  -  45o
V-scoring +/-0.1mm,   15o    30o    45o    60o 
Impedance  Control                                Min. 5%    General  ± 10%
Surface  Finishing  HASL,   HASL(lead  Free),   Immersion  Gold 
Immersion  Silver,   OSP,   Hard  Gold  (  up  to  100u" )
Certification UL  RoHS  ISO9001: 2000  ISO14000: 2004  SGS
Testing Flying  probe, E-TEST,   X-RAY  Inspection  , AOI
Files Gerber  Protel  DXP  Auto  CAD  PADS  OrCAD  Express  PCB  etc
 


 

Can You Show some Pictures of  the PCB factory? 
Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability LossDigital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss


Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss



How to pay and how to ship? 

Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss




FAQ
 

Q1: What's your minimum order quantity?

A1: No MOQ , 1 pcs is accepted . 

 

Q2: what file we should offer?

A2: PCB:Gerber file is better,( Protel ,power pcb,PADs file), PCBA : Gerber file and BOM list.

 

Q3:No PCB file/Gerber file, only have the PCB sample,can you produce it for me?

A3: Yes, we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB layout and work out the PCB files, then produce for you.  

 

Q4: What is the lead time?

A4:Sample needs 7-10 days, mass production needs 10- 15 days, 

according to the order volume.Also we can provide quick time service 1-2days.

 

Q5: What payment terms do you have?

A5: For small orders, we usually prefer Paypal and Western Union; For bigger order,pls pay by TT.

Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss
 

Digital Twin-Based OSP Aging Simulation PCB Using Real-Time Humidity, Temperature, and Handling Frequency Data to Predict Solderability Loss

 

 



 

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