Multilayer Rigid-Flex Printed Circuit PCB Board Manufacturing FPC

• Structure: Double-Sided FPC
• Material: Polyimide
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Model NO.: FLCA-Q008
• Processing Technology: Electrolytic Foil
• Base Material: Polyimide
• Insulation Materials: Epoxy Resin
• Board Material: Polyimide
• Board Layer: 2
• Board Thickness: 0.1 mm
• Copper Thickness: 1 Oz
• Solser Mask: Yellow
• Silkscreen: White
• Surface Finishing: Enig
• Lead Time: 4-5 Working Days
• Shipping Type: DHL.TNT, EMS, FedEx, UPS etc
• PCB Design: Custom Design Product
• Testing: 100%
• Service: One-Stop
• Mini Hole: 0.1mm
• Mini Track: 3/3mil
• Package: Vacuum +Carton
• Transport Package: Vacuum +Carton Packing
• Specification: RoHS, ISO9001, UL, SGS
• Trademark: FL
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000square Meter/Mon

Product Description

Multilayer Rigid-Flex Printed Circuit Board Manufacturing 

Dear buyer,

Thank you for scanning our website about FPC.
As is known,PCB is customized product ,so the unit price is not real,details please contact me and a quotation will be offered.Please send us PCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd" .
 

 

 

Product Description

Standard Flex Materials:

 

Polyimide (Kapton) : 0.5 mil to 5 mils (.012mm - .127mm) 
Adhesiveless Copper Clad Base Material : 1 mil to 5 mils 
Flame Retardant Laminate, Base Material, and Coverlay 
High Performance Epoxy Laminate and Prepreg 
High Performance Polyimide Laminate and Prepreg 
UL and RoHS Compliant Material on request 
High Tg FR4 (170+ Tg), Polyimide (260+ Tg) 

Base Copper: 
1/3 oz. - .00047 in. (.012mm)--rarely used 
1/2 oz. - .0007 in. (.018mm) 
1 oz. - .0014 in. (.036mm) 
2 oz. - .0028 in. (.071mm) 

Solder Mask: 
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm) 
with 0.5 to 2 mil Adhesive (.012mm - .051mm) 
LPI and LDI Flexible Soldermasks

Flex PCB Capability

Fastline Circuits Co., Limited
FPC Technology and Capabilities
Material	FR4,Polyimide / Polyester
Counts	Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness	Min.0.05mm ;  Max. 0.3mm
Copper Thickness	1/3 oz --- 2 oz
CNC Drill Size (Max)	6.5mm
CNC Drill Size (Min)	Flex: 0.15mm
Holes Location Tolerance	±0.05mm
Coverlay Drill Size (Min)	0.6mm
Hole to Coverlay Opening Windows (Min)	0.15mm
Min Line Width / Spacing	0.1/0.1mm
Copper Thickness on Hole Wall	Flex:12-22μm
Min Pad Size	φ0.2mm
Etch Tolerance	Finished line width tolerance ±20%
Pattern Registration Tolerance	±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance	±0.15mm
Solder Mask Registration Tolerance	±0.2mm
Solder Mask to PAD	Non photosensitive: 0.2mm
	Photosensitive: 0.1mm
Min. Solder Mask Dam	0.1mm
Misregistration Tolerance	±0.30mm
for Stiffener, Adhesive, Glue paper
Surface Finish	Plating Ni / Au ; Chemical Ni / Au ; OSP

Would like to know more about the product? Send us inquiry, click "Send" now!

Please feel free to send us gerber file for lastest price and discount!

 

Contact Person:Grace Zhou
 
Web:fastlinepcb.en.made-in-china.com