HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets

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Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
  • HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
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  • Overview
  • Company Profile
  • Certifications
  • Products & Capability
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
FLCA-031
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Board Material
Fr4 Tg150
Regular Board Thickness
1.6mm
Board Layer
2
Copper Thickness
1 Oz
Max PCB Size
1200*500mm
Min Hole Size
0.075mm(3mil)
Min Trace
0.05mm(2mil)
Min Conductor Width
0.05mm(2mil)
Min Board Thickness
0.1mm
Min Pad
+/-0.1mm (4mil)
Outline Machining Accuracy
+/-0.1mm (4mil)
Surface Finishing
Enig, OSP, Immersion Gold, Immersion Tin
Solder Mask
Any
MOQ
1PCS
Lead Time
4-5 Working Days
Transport Package
Vacuum+Carton Packing
Specification
RoHS, ISO9001, UL, SGS
Trademark
FL
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000 Square Meter/Mon

Packaging & Delivery

Package Size
38.00cm * 30.00cm * 35.00cm
Package Gross Weight
2.000kg

Product Description

XH-M562 Ultra-Compact TPA3116D2 Digital Audio Amplifier Board D Class Dual 50W Stereo Power Amp Module RoHS UL Certified PCB PCBA Custom Factory Price No MOQXH-M562 Ultra-Compact TPA3116D2 Digital Audio Amplifier Board D Class Dual 50W Stereo Power Amp Module RoHS UL Certified PCB PCBA Custom Factory Price No MOQ
 

Company Profile

 
-- Company  Profile --

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
Fastline Circuits, which is a  leading PCB manufacturer in China,providing PCB fabrication,PCB clone and PCB assembly services, and we have got the UL, ISO, SGS certifications. And we also provide 24 hours quick turn PCB prototype service.

How can we do for you?
1 R&D team support
2 UL, RoHS,ISO9001
3.IPC class2
4.Advanced production line and promptly delivery.
5,Honest Credibility in China.
6.Professional and abundant experience in PCB.
7.Competitive price and good quality.
8. Excellent after-sales service.

 

Certifications

-- Certifications --
HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets
HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked & Staggered Via Options for Smartphones & Tablets

,

Products & Capability

Overall Manufacturing Capability

Item Details
Number of Layers 1 - 50 layers
High - Frequency Pressurized HDI Ceramics, PTFE materials can only use mechanical drilling for blind/buried vias, controlled - depth drilling, back - drilling, etc. (Laser drilling not allowed, cannot directly laminate copper foil)
High - Speed HDI Manufactured according to regular HDI standards
Laser Stages 1 - 5 stages (Review required for ≥ 6 stages)
Board Thickness Range 0.1 - 5.0mm (Review required for < 0.2mm or > 6.5mm)
Minimum Finished Product Size Single board 5*5mm (Review required for < 3mm)
Maximum Finished Product Size 2 - 20 layers: 21*33 inches; Note: Review required if the shorter side exceeds 21 inches
Maximum Finished Copper Thickness Outer layer: 8OZ (Review required for > 8OZ); Inner layer: 6OZ (Review required for > 6OZ)
Minimum Finished Copper Thickness 1/2oz
Interlayer Alignment Accuracy ≤ 3mil
Through - Hole Filling Range Board thickness ≤ 0.6mm, Hole diameter ≤ 0.2mm
Resin Plugging Board Thickness Range 0.254 - 6.0mm, Review required for resin plugging on PTFE boards
Board Thickness Tolerance Board thickness ≤ 1.0mm: ± 0.1mm
Board thickness > 1.0mm: ± 10%
Impedance Tolerance ± 5Ω (< 50Ω), ± 10% (≥ 50Ω); ± 8% (≥ 50Ω, Review required)
Warpage Regular: 0.75%, Extreme: 0.5% (Review required), Maximum: 2.0%
Lamination Times ≤ 5 times for the same core lamination (Review required for > 3 times)
 
 

  --  Products   --


HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; TabletsHDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets
HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; TabletsHDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; TabletsHDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; TabletsHDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets

--  PCBA  Manufacturing Capability --

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets
--  Application  --

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets

Packaging & Shipping

-- Packaging Shipping --
 

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets

 

 

 

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets

 

FAQ

-- FAQ --
 

 

HDI PCB with Micro Vias 0.1mm Laser Drilling Stacked &amp; Staggered Via Options for Smartphones &amp; Tablets

 

Very appreciate to contact us

 



 






 

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