Tarnish-Resistant Immersion Silver PCB with Dual-Layer Organic Passivation and Sealed Nitrogen Post-Treatment Encapsulation

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: FR-4
• Model NO.: FLCA-045
• Material: Polyester Glass Fiber Mat Laminate
• Application: Communication
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Fr4
• Insulation Materials: Epoxy Resin
• Board Thickness: 1.6mm
• Board Layer: 2 Layers
• Copper Thickness: 1 Oz
• Solder Mask: Green
• Silksreen: White
• Surface Finihsing: HASL-Lf
• Lead Time: 6-8 Working Days
• Min. Hole Size: 0.20 mm
• Min Line Width&Space: 0.15 mm
• Board Material: Aluminum
• Transport Package: Vacuum+Carton Packing
• Specification: RoHS, ISO9001, UL, SGS
• Trademark: FL
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000 Square Meter/Mon
• Package Size: 38.00cm * 35.00cm * 35.00cm
• Package Gross Weight: 2.000kg

Product Description

ODM/ ODM Custome Intelligent Car Wash System Main Control PCB/PCBA High-Stability Waterproof Circuit Board Anti-Interference SMT/DIP Precision Assembly No MOQ

 

Fastline Circuits Co., Limited is a China-based expert in PCB & PCBA manufacturing, founded in 2003 to address complex electronic component needs.

Our technical capabilities stand out:

• PCB Manufacturing: Supports 1-50 layers (FR4), 8L FPC, 10L rigid-flex PCB; handles materials like FR-4, high-Tg, Rogers, aluminum/copper-based substrates; achieves min. 3mil line space, 4mil laser drilling, and ±5% impedance control.
• PCBA Assembly: 15 SMT lines (0.3mm QFP pitch, 0.25mm BGA pitch), full turn-key/partial turn-key services, and multi-stage testing (AOI, X-ray, ICT, functional test).

We operate 40,000+ square meter factories with advanced equipment (flying probe testers, X-RAY machines, impedance test systems) and 1,000+ skilled staff. Certified to ISO9001, IATF16949, and UL (RoHS/REACH compliant), we deliver reliable solutions to 40+ countries, with 70% exports to key global markets.
 

OEM/ODM Services
Seq Item		Technical Specification Standard
Number of Layer		1-30layers
Maximum Size		700*1500
Material		FR4(Tg130-180), Halogen free lamination,Rogers,Aluminum board,Arlon
HDI	HDI(1-7 steps)|R-FPC(2-16 layers)|High frequency mix-pressing(2-20 layers)
Line width/space (mil)		2/2mil			H/HOZ base copper
		2.5/2.5mil 3/3mil 4/4mil			Cu thickness<=1oz
		7/7mil			Cu thickness<=2oz
		9/9mil			Cu thickness<=3oz
		11/11mil			Cu thickness<=5oz
Hole size	Board thickness<2.0mm	0.2mm			inished hole
	Board thickness>=0.2mm	0.1mm			inished hole
	Board thickness>=0.2mm	thickness-diameter ratios≤12:1			inished hole
Finish Board Thickness	1-2layer	0.2-8.0mm
	4layer	0.4-8.0mm
	6layer	0.6-8.0mm
	8layer	1.0-8.0mm
	>=10 layer	1.2-8.0mm
finished Cu Thickness	outlayer	1OZ-15OZ
	inlayer	HOZ-15OZ
Solder Mask	Solder mask Line to solder PAD	4MIL
	Registration tolerance	+/-2MIL
	color	White,black,blue,green,red and so on
Profile tolerance	Punching	±5mil
	Routing	±4mil
Surface finish	Hasl,LF-hasl,ENIG,Imm Tin,Imm Ag,OSP,Gold finger
HASL thickness		SMD:40-2000u GND:30-800u"
Immersion Au		Au thickness 1-5u" Ni thickness 80-600u"
Immersion tin thickness		0.8-1.2um
OSP thickness		0.2-0.5um
Immersion silver thickness		0.15-0.45um

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