OEM/ ODM Customized Competitive Price LCD TV PCB Board Assembly TV PCBA PCB Assembly Motherboard Prototype Mass Production Manufacturer No MOQ
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Product Details
| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
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Basic Info.
- Model NO.
- 20250627001
- Material
- Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties
- HB
- Mechanical Rigid
- Rigid
- Processing Technology
- Electrolytic Foil
- Base Material
- Copper
- Insulation Materials
- Epoxy Resin
- Model
- FR-4
- Brand
- Fastline
- Certificate
- ISO9001, ISO14001, ISO13485, Ts-16949, etc
- Copper Thickness
- 0.5oz/1oz/2oz/3oz/4oz
- Board Thickness
- 0.2mm-7mm
- Solder Color
- Green, Red, White, Black, Yellow, Blue
- Supplier
- Manufacturer
- SMT Lines
- 12 Lines
- Test
- Aoi/ X-ray/ Functional Test
- Cquality
- <0.02% Defect
- Finish
- Enig/Silver/ Golden
- Transport Package
- Individual Packaging
- Specification
- 20*12*6
- Trademark
- Fastline
- Origin
- China
- HS Code
- 853400
- Production Capacity
- 50000pieces/Year
Packaging & Delivery
- Package Size
- 25.00cm * 12.00cm * 6.00cm
- Package Gross Weight
- 8.000kg
Product Description
OEM/ ODM Customized Competitive Price LCD TV PCB Board Assembly TV PCBA PCB Assembly Motherboard Prototype Mass Production Manufacturer No MOQ
What we can do?
Parameter & Data Sheet
Why Choose us ?
Factory workshop:
| PCB Max. size | DIP capacity |
| Min component size | 0201 |
| Min.pin space of IC | 0.3mm |
| Min. space of BGA | 0.3mm |
| Max.precision of IC assembly | ±0.03mm |
| SMT capacity | ≥2 million points/day |
| DIP capacity | ≥100k parts/day |
What we can do?
| SMT(Surface Mounting technology),DIP. |
| 1. Material Sourcing Service |
| 2. SMT assembly and Through hole components insertion |
| 3.100% AOI testing |
| 4. IC pre-programming / Burning on-line |
| 5.ICT testing |
| 6.Function testing as requested |
| 7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
| 8.Conformal coating |
| 9.OEM/ODM also welcomed |
Parameter & Data Sheet
| Size of Rigid-Flexible PCB | 95 X 88mm |
| Number of Layers | 2 |
| Board Type | Rigid-Flexible PCB |
| Board Thickness | 0.10mm |
| Board Material | Polyimide 25µm |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | NO |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Why Choose us ?
Factory workshop:
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