Parameter & Data Sheet
Low-Cost FR4 Multilayer PCB - Professional Mechanical Customization
Product Overview
As a 19+ year ISO-certified PCB manufacturer, we specialize in cost-effective FR4 multilayer PCBs without compromising quality. Our solutions combine mechanical customization with high-volume manufacturing, serving industrial control, consumer electronics, and telecom clients worldwide.
Core Features
- Material: FR-4 epoxy glass fiber (UL94 V-0 flame-rated), 0.2mm-3.2mm thickness with ±0.03mm precision for 0.2mm ultra-thin boards.
- Layers: 1-60+ multilayer design for complex circuitry requiring signal isolation.
- Cost Optimization: Volume pricing starts at 100 pieces, 20% lower than industry average for 10-layer boards.
Mechanical Customization
- Form Factor: Laser-cut complex shapes (tolerance ±0.1mm), threaded vias (M1-M5) for mounting.
- Thermal Management: 0.3mm thermal vias (thermal resistance ≤10ºC/W), aluminum stiffeners optional.
- Edge Treatment: V-cut panelization (5-10N breaking force), beveled edges.
Electrical Specifications
- Trace Technology: 0.075mm/3mil line width (1oz copper), 50Ω controlled impedance (±5%).
- Surface Finishes: ENIG, HASL LF, OSP (RoHS compliant).
- Testing: 100% AOI + flying probe, IPC-A-600G Class 2/3.
Cost-Effective Production
- DFM Review: Free layer stack optimization (e.g., 4-layer vs 6-layer to cut costs by 30%).
- Global Hubs: China for 24h prototyping, Thailand/Malaysia for low-cost mass production (zero US/EU tariffs).
- Pre-stocked FR-4 reduces lead times by 3 days
Applications
- Industrial: PLC panels, sensor interfaces ($2.50-$15.00 per board).
- Consumer: Smart home hubs, wearable mainboards (1.2mm, 4-layer).
- Telecom: Network switches with 10-layer signal/power separation
Ordering Info
- Files: Gerber, thickness, copper thickness, surface finish, solder mask color, quantity.
- Lead Times: 3-5 days (prototypes), 7-15 days (1-10 layers mass production).
- MOQ: 1 (prototype), 100 (mass production, negotiable).
Quality Assurance
- Certifications: ISO 9001, IATF 16949, UL materials.
- Testing: Thermal cycle (-40ºC~+85ºC, 1000 cycles), humidity (85ºC/85% RH, 96h).
- Warranty: 12-month defect-free guarantee, free replacement for manufacturing errors.
Contact us for a custom quote-DFM report and cost breakdown within 2 hours.
| Size of Flexible PCB |
30.5X 25.5mm |
| Number of Layers |
2 |
| Board Type |
Flexible circuits |
| Board Thickness |
0.30mm |
| Board Material |
Polyimide (PI) 25µm |
| Board Material Supplier |
Shengyi |
| Tg Value of Board Material |
60ºC |
| |
| PTH Cu thickness |
≥20 µm |
| Inner Iayer Cu thicknes |
N/A |
| Surface Cu thickness |
35um |
| |
| Coverlay Colour |
Yellow |
| Number of Coverlay |
2 |
| Thickness of Coverlay |
25 µm |
| Stiffener Material |
NO |
| Stiffener Thickness |
N/A |
| |
| Type of Silkscreen Ink |
NO |
| Supplier of Silkscreen |
N/A |
| Color of Silkscreen |
N/A |
| Number of Silkscreen |
N/A |
| |
| Peeling test of Coverlay |
No peelable |
| Legend Adhesion |
3M 90ºC No peeling after Min. 3 times test |
| |
| Surface Finish |
Immersion Gold |
| Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required |
Yes |
| Famability |
94-V0 |
| |
| Thermal Shock Test |
Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function |
100% Pass electrical test |
| Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
Audited Supplier 
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