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  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB
  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB
  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB
  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB
  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB
  • Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB

Professional Alu Printed Circuit Board Lay out with Fast Ceramic PCB

Gold Member Since 2013

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Manufacturer/Factory

Basic Info.

Model NO.
BV-Q0155
Processing Technology
Electrolytic Foil
Base Material
Ceramic
Insulation Materials
Organic Resin
Brand
Fastline
Board Material
Ceramic
Board Thickness
1.6 mm
Copper Thickness
1 Oz (35um)
Surface Treatment
HASL Lead Free
Transport Package
Vacuum Packing
Specification
Certificates: UL, ROHS
Trademark
FL
Origin
China
HS Code
8534009000
Production Capacity
20000 Square Meter/Mon

Product Description

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Gold Member Since 2013

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Manufacturer/Factory
Registered Capital
5000000 RMB
Plant Area
>2000 square meters