Customized Buried Blind Vias PCB Circuit Board Assembly Manufacturing PCBA

• Customization: Available
• Board Thickness: 1.6mm
• Copper Thicknes: 1oz
• Model NO.: BV-Q0156
• Solder Mask: Green
• Silk Screen: White
• Material: Fr4
• Surface: Enig
• Mini Hole: 0.1mm
• Mini Trace: 0.15mm
• PCB Type: Buried Blind Vias PCB
• Test: 100% Test
• Small Order: Accepted
• Lead Time: 5-10 Days
• Service: High Quality
• MOQ: 1 PCS
• Supply: Fast
• Transport Package: Vacuum+Carton Packing
• Specification: RoHS, ISO9001, UL, SGS
• Trademark: FL
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000square Meter/Mon

Product Description

Buried Blind Vias PCB Circuit Boards Assembly Manufacturing PCBA

Fastline Circuits, which is a  leading PCB manufacturer in China,providing PCB fabrication,PCB clone and PCB assembly services, and we have got the UL, ISO, SGS certifications. And we also provide 24 hours quick turn PCB prototype service.

How can we do for you?

1 R&D team support
2 UL, RoHS,ISO9001
3.IPC class2
4.Advanced production line and promptly delivery.
5,Honest Credibility in China.
6.Professional and abundant experience in PCB.
7.Competitive price and good quality.
8. Excellent after-sales service.

PCB  Manufacture  Capability
Item	Manufacture  Capability
Layers	1-26  Layers
HDI	2+N+2
Material  Types	Fr-4,   Fr-5,   High-Tg,   Aluminum  Based  , Halogen  Free,
	Isola,   Taconic,   Arlon,   Teflon,   Rogers,
Max.   Panel  Dimension	39000mil  *  47000mil  (1000mm  *  1200mm)
Outline  Tolerance	± 4mil  (± 0.10mm)
Board  Thickness	8mil-236mil  (0.2  -  6.0mm)
Board  Thickness  Tolerance	± 10%
Dielectric  Thickness	3mil-8mil  (  0.075mm-0.20mm)
Min.   Track  Width	3mil  (  0.075mm  )
Min.   Track  Space	3mil  (  0.075mm  )
External  Cu  Thickness	0.5  OZ  -  10  OZ  (  17um  -  350um)
Internal  Cu  Thickness	0.5OZ  -  6OZ  (  17um  -  210um)
Drilling  Bit  Size  (  CNC  )	6mil-256mil  (  0.15mm  -  6.50mm)
Finished  Hole  Dimension	4mil-236mil(0.1mm  -  6.0mm)
Hole  Tolerance	± 2mil  (± 0.05mm)
Laser  Drilling  Hole  Size	4mil(0.1mm)
Aspect  Ration	16: 1
Solder  Mask	Green,   Blue,   White,   Black,   Red,   Yellow,   Purple,   etc.
Min  Solder  mask  Bridge	2mil(0.050mm)
Plugged  Hole  Diameter	8mil-20mil  (  0.20mm-0.50mm)
Beveling	30o  -  45o
V-scoring	+/-0.1mm,   15o    30o    45o    60o
Impedance  Control	Min. 5%    General  ± 10%
Surface  Finishing	HASL,   HASL(lead  Free),   Immersion  Gold
	Immersion  Silver,   OSP,   Hard  Gold  (  up  to  100u" )
Certification	UL  RoHS  ISO9001: 2000  ISO14000: 2004  SGS
Testing	Flying  probe, E-TEST,   X-RAY  Inspection  , AOI
Files	Gerber  Protel  DXP  Auto  CAD  PADS  OrCAD  Express  PCB  etc

Very appreciate to contact us

Contact Person: Grace zhou
Phone: [phone]