Multilayer Rigid Flexible Design Pcbr Igid-Flex PCB for Camera Board

• Type: Rigid Circuit Board
• Dielectric: Fr4+Pi
• Material: Fiberglass Epoxy
• Application: Medical Instruments
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid +Flex
• Model NO.: pcb
• Processing Technology: Electrolytic Foil
• Base Material: Fr4+Pi
• Insulation Materials: Organic Resin
• Brand: FL
• Board Material: Fr4+Pi
• Board Thickness: 1.6mm
• Copper Thickness: 1oz
• Surface Treatment: Immersion Gold
• Product Name: PCB Manufacturer Immersion Gold 8L Rigid Flex PCB
• Package: Carton + Vacuum
• Small Order: 1 PCS
• Transport Package: Vacuum+Carton Packing
• Specification: UL, SGS, ROHS
• Trademark: Fastline
• Origin: China
• HS Code: 853400900
• Production Capacity: 20000square Meter/Mon

Product Description

Multilayer Rigid Flexible Design PCBR igid-Flex PCB For Camera Board

 

Hi buyer,

Thank your for scanning our Rigid-Flex PCB Products.

As is known,PCB  is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber files, ".pcbdoc", ".lay", ".lay6" or ".brd" .

 

Product Description

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) 
Adhesiveless Copper Clad Base Material 1 mil to 5 mils 

Flame Retardant Laminate, Base Material, and Coverlay 
High Performance Epoxy Laminate and Prepreg 
High Performance Polyimide Laminate and Prepreg 
UL and RoHS Compliant Material on request 
High Tg FR4 (170+ Tg), Polyimide (260+ Tg) 

Base Copper: 
1/3 oz. - .00047 in. (.012mm)--rarely used 
1/2 oz. - .0007 in. (.018mm) 
1 oz. - .0014 in. (.036mm) 
2 oz. - .0028 in. (.071mm) 

Solder Mask: 
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm) 
with 0.5 to 2 mil Adhesive (.012mm - .051mm) 
LPI and LDI Flexible Soldermasks

 

Rigid-Flex PCB Capability

 

Fastline FPC board and Rigid-flex PCB capability
Technology and Capabilities
Material	Polyimide / Polyester
Counts	Flex: 1~8L; Rigid-Flex: 2~8L
Board Thickness	Min.0.05mm ;  Max. 0.3mm
Copper Thickness	1/3 oz --- 2 oz
Maximum dimensions	For FPC:250mm*1200mm(normal); 250mm*100,000mm
CNC Drill Size (Max)	6.5mm
CNC Drill Size (Min)	Flex: 0.15mm
Holes Location Tolerance	±0.05mm
Coverlay Drill Size (Min)	0.6mm
Hole to Coverlay Opening Windows (Min)	0.15mm
Min Line Width / Spacing	0.1/0.1mm
Aspect Ratio	61
Copper Thickness on Hole Wall	Flex:12-22μm
Min Pad Size	φ0.2mm
Etch Tolerance	Finished line width tolerance ±20%
Pattern Registration Tolerance	±0.1mm (Working Panel Size: 250*300mm)
Coverlay Registration Tolerance	±0.15mm
Solder Mask Registration Tolerance	±0.2mm
Solder Mask to PAD	Non photosensitive: 0.2mm Photosensitive: 0.1mm
Min. Solder Mask Dam	0.1mm
Misregistration Tolerance for Stiffener, Adhesive, Glue paper	±0.30mm
Surface Finish	Plating Ni / Au ; Chemical Ni / Au ; OSP

 

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