Hybrid Printed Circuit Board PCB 4 Layers RO435b and Fr4 0.508mm Dielectric Immersion Gold PCB

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Application: Communication
• Flame Retardant Properties: V1
• Mechanical Rigid: Rigid
• Model NO.: L010
• Processing Technology: Electrolytic Foil
• Base Material: Fr4
• Insulation Materials: Epoxy Resin
• Brand: Fastline
• Board Thickness: 1.6mm
• Copper Thickness: 1oz
• Material Type: Fr4
• Surface Treatment: HASL Lead Free
• Solder Mask: Green, Red, Blue, Black
• Silk Screen Color: White
• Board Layer: 1-50
• Shipping Type: DHL, UPS, TNT, EMS, FedEx etc
• Packing Type: Carton + Vacuum
• Lead Time: 5-7 Days
• Transport Package: Vacuum+Carton Packing
• Specification: RoHS, ISO9001, UL, SGS
• Trademark: Fastline
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000 Square Meter/Mon

Product Description

Product Description

Hybrid Printed Circuit Board PCB 4 Layers RO435B and FR4 0.508mm Dielectric Immersion Gold PCB






Commodity Introduction

This is a type of FR-4 and RO4350B PCB for the application of RF transceiver. It's a 4  layer board at 1.6mm thick. The base laminate is from ITEQ and ROGERS CORP., Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately. 





Parameters & Data Sheet

PCB SIZE	295 x178mm=1PCS
BOARD TYPE
Number of Layers	Multilayer Hybrid PCB, 4 layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	Top layer, copper ------- 35 µm(1 oz) TOP layer
	0.508mm RO4350B (dielectric 1)
	GND layer, copper ------- 35 µm(1 oz) MidLayer 1
	0.40mm FR-4 (dielectric 2)
	Signal layer, copper ------- 35 µm(1 oz) MidLayer 2
	0.60mm FR-4 (dielectric 2)
	Bottom layer, copper ------- 35 µm(1 oz) BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5 mil/5.3 mil
Minimum / Maximum Holes:	0.3/5.98mm
Number of Different Holes:	14
Number of Drill Holes:	631
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 TG135ºC and RO4350B Tg 288ºC
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.6mm ±10%
PLATING AND COATING
Surface Finish	Immersion gold (11.9% ), 0.05 um gold over 3 um nickel
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing.
MARKING
Side of Component Legend	TOP.
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH)
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	RF transceiver, Switching Mode Power Supply Switch Power Supply DC Variable Power Supply Puls Power Supply 24 VDC Power Supply
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Microsection Hole Wall (um)

Hole Wall Cu Thickness			≥20 um	Hole Wall Cu Roughness			≤25.4 um
NO.	A	B	C	D	E	F	AVE
1	22.800	22.300	23.700	23.700	22.300	24.500	23.000
2	27.000	22.300	22.500	22.500	22.500	22.600	23.600
3	23.000	22.300	27.000	27.000	22.300	22.800	23.400

Outline dimension  Unit: mm

NO.	Required Dimension (toerance)		Actual dimension
1	97.00	±0.15	97.02	97.01	97.01	97.02
2	100.00	±0.15	100.02	100.01	99.99	100.01

Hole Size and Slot Dimension (mm)

NO.	Requerment Dimension (tolerance)		PTH/NPT	Actual dimension
1	0.250	±0.076	Y	via	via	via	via
2	0.406	±0.076	Y	via	via	via	via
3	3.174	±0.076	Y	3.200	3.175	3.175	3.200

Workshop:




Our service:
 

PCB capability and services:

1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, 
good quality  and excellent service.

2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. 

3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. 

4. Quantities range from sample to mass order

5. 100% E-Test 

 

SMT(Surface Mounting technology),DIP.

1. Material Sourcing Service

2. SMT assembly and Through hole components insertion

3.100% AOI testing

4. IC pre-programming / Burning on-line

5.ICT testing

6.Function testing as requested 

7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)

8.Conformal coating

9.OEM/ODM also welcomed

FAQ
 
Q1: Are you a factory or trade company?
A1: We have our own PCB manufacturing & Assembly factory.

Q2: What's your minimum order quantity?
A2: Our MOQ is not the same based on different items. Small orders are also welcome.
 
Q3: What kinds of file should we offer?
A3: For PCB: Gerber file is better, (Protel, power PCB, PADs file), for PCBA: Gerber file and BOM list.

Q4: No PCB file/GBR file, only have the PCB sample, can you produce it for me?
A4: Yes, we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q5: What any other information should be offered except for file?
A5: Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen
f) Quantity
 
Q6: I am very satisfied after I read your information, how can I start to purchase my order?
A6: Please click the "send" at the bottom of this page or contact our sales on Trade Manage online!

Q7: What is delivery terms and time?
A7: We usually use FOB terms and ship the goods in 7-30 days depend on your order quantity, customization.