Customization: | Available |
---|---|
Structure: | Double-Sided FPC |
Material: | Polyimide |
Still deciding? Get samples of $ !
Request Sample
|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Fastline Flexible Printed Circuit Capability | ||
No. | Specifications | Capabilities |
1 | Board Type | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
2 | Base Material | PI, PET |
3 | Copper Weight | 0.5oz, 1oz, 2oz |
4 | LED Maximum Size | 250 x 5000mm |
5 | General Maximum Size | 250 x 2000mm |
6 | Board Thickness | 0.03mm-3.0mm |
7 | Thickness Tolerance | ±0.03mm |
8 | Mininum Drill Hole | 0.05mm |
9 | Maximum Drill Hole | 6.5mm |
10 | Tolerance of Drill Hole | ±0.025mm |
11 | Thickness of Hole Wall | >= 8 um |
12 | Minimum Track/Gap of Single Layer Board | 0.025/0.03mm |
13 | Minimum Track/Gap of Double Layer and Multilayer Board | 0.03/0.040mm |
14 | Etching Tolerance | ±0.02mm |
15 | Minimum Width of Silk Legend | >= 0.125mm |
16 | Minimum Heigh of Silk Legend | >=0.75mm |
17 | Distance from Legend to Pad | >=0.15mm |
18 | Distance from Opening Solder Mask of Drill Coverlay to Track | >=0.03mm |
19 | Distance from Opening Solder Mask of Punching Coverlay to Track | >=0.03mm |
20 | Thickness of Immersion Nickel | 100-300u" |
21 | Thickness of Immersion Gold | 1-3u" |
22 | Thicnkess of Immersion Tin | 150-400u" |
23 | Minimum Electrical Testing Pad | 0.2mm |
24 | Minimum Tolerance of Outline(Normal Steel Mould Punch) | ±0.1mm |
25 | Minimum Tolerance of Outline (Precision Steel Mould Punch) | ±0.05mm |
26 | Mininum Radius of Bevel Angle (Outline) | 0.2mm |
27 | Stiffner Material | PI, FR-4, 3M Adhesive, PET, Steel Sheet |
28 | RoHs | Yes |
29 | Solder Mask Colour | Yellow, White, Black, Green |
Size of Flexible PCB | 30.5 X 10.38mm |
Number of Layers | 2 |
Board Type | Flexible PCB |
Board Thickness | 0.10mm |
Board Material | Polyimide 25µm |
Board Material Supplier | Shengyi |
Tg Value of Board Material | 60ºC |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | N/A |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | NO |
Stiffener Thickness | N/A |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |