Wholesale Price Customized Printed Circuit Board Components PCB

Product Description

Wholesale price customized  printed circuit board components



Product Description

                                                 Fastline  PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction



*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)
We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours

Technical Capabilities
 

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil   Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

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