Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth

Product Details
Customization: Available
Insulation Materials: Metal Composite Materials
Flame Retardant Properties: HB
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
  • Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with <5um Spatial Resolution Detecting Resin Carbonization Depth
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Basic Info.

Model NO.
BL-0012
Application
Aerospace
Board Thicknes
1.6mm
Copper Thickness
1oz
Material Type
Fr4
Surface Treatment
HASL Lead Free
Solder Mask
Green, Red, Blue, Black
Silk Screen Color
White
Board Layer
1-50
Shipping Type
DHL, UPS, TNT, EMS, FedEx etc
Packing Type
Carton + Vacuum
Lead Time
10 Workdays
Structure
Multilayer FPC
Material
Polyimide
Combination Mode
Adhesive Flexible Plate
Conductive Adhesive
Conductive Silver Paste
Processing Technology
Electrolytic Foil
Transport Package
Vacuum+Carton Packing
Specification
0.2kg
Trademark
Fastline
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000PCS/Month

Packaging & Delivery

Package Gross Weight
1.000kg

Product Description

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth
Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth
Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth

 

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Product Description

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) 
Adhesiveless Copper Clad Base Material 1 mil to 5 mils 
Flame Retardant Laminate, Base Material, and Coverlay 
High Performance Epoxy Laminate and Prepreg 
High Performance Polyimide Laminate and Prepreg 
UL and RoHS Compliant Material on request 
High Tg FR4 (170+ Tg), Polyimide (260+ Tg) 
Base Copper: 
1/3 oz. - .00047 in. (.012mm)--rarely used 
1/2 oz. - .0007 in. (.018mm) 
1 oz. - .0014 in. (.036mm) 
2 oz. - .0028 in. (.071mm) 
Solder Mask: 
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm) 
with 0.5 to 2 mil Adhesive (.012mm - .051mm) 
LPI and LDI Flexible Soldermasks

 

Flex PCB Capability

Fastline Circuits Co., Limited

FPC Technology and Capabilities

Material

FR4,Polyimide / Polyester

Counts

Flex: 1~8L; Rigid-Flex: 2~8L

Board Thickness

Min.0.05mm ;  Max. 0.3mm

Copper Thickness

1/3 oz --- 2 oz

CNC Drill Size (Max)

6.5mm

CNC Drill Size (Min)

Flex: 0.15mm

Holes Location Tolerance

±0.05mm

Coverlay Drill Size (Min)

0.6mm

Hole to Coverlay Opening Windows (Min)

0.15mm

Min Line Width / Spacing

0.1/0.1mm

Copper Thickness on Hole Wall

Flex:12-22μm

Min Pad Size

φ0.2mm

Etch Tolerance

Finished line width tolerance ±20%

Pattern Registration Tolerance

±0.1mm (Working Panel Size: 250*300mm)

Coverlay Registration Tolerance

±0.15mm

Solder Mask Registration Tolerance

±0.2mm

Solder Mask to PAD

Non photosensitive: 0.2mm

Photosensitive: 0.1mm

Min. Solder Mask Dam

0.1mm

Misregistration Tolerance

±0.30mm

 for Stiffener, Adhesive, Glue paper

Surface Finish

Plating Ni / Au ; Chemical Ni / Au ; OSP

 

 

Flex PCB showcase:

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth

 

 

 

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Our Services

PCB & PCBA service:

We provide One-stop service from PCB design, components sourcing, assembly and function test and final production built.  We also provide PCB&PCBA clone or copy service.

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth
 

 

Lead Time & Payment terms

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth
 

 

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Company Information

Fastline is a Leading PCB manufacturer in China. It was found in 2003, serving customers in over 40 countries from various electronic industries, Over 70% of products are exported to America, Europe and other Asia Pacific countries.

Fastline could meet all your PCB manufacturing needs, including High multilayer PCB, Aluminum based PCB, HDI PCB, Rigid-flex PCB, heavy copper PCB, and PCB assembly as well. Our products are widely applied in telecom, industrial control, power electronics, medical instrument , security electronics, aerospace and so on. And Provides "PCB One-stop PCB solution" to meet customers' diverse demands.

Our factories with a facility area of more than 40,000 square meters with 400 professional staff,And we have got the approval of  ISO9001 certificates. UL Certification and all Products Meet RoHS compliance. 

Fastline Circuits is committed to providing superior quality products and services that consistently meet and exceed our customers requirements on time, every time!

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth


 

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Certifications

Laser Drilling Heat-Affected Zone (HAZ) Mapping PCB Via Raman Spectroscopy with &lt;5um Spatial Resolution Detecting Resin Carbonization Depth
 

 

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FAQ

 

What service can you provide?

We can provide PCB gerber file design,Copy and Clone,OEM and ODM service.

Not only produce PCB,PCB Assembly.

 

What's your minimum order quantity?

Our MOQ is not the same based on different items. Small orders are also welcome.

 

what file we should offer?

 PCB:Gerber file is better,( Protel ,power pcb,PADs file),    PCBA : Gerber file and BOM list.

 

Can you provide quick turn PCB?

Yes,we can provide quick time service 1-2days.

 

What payment terms do you have?

For small orders, we usually prefer Paypal and Western Union; For bigger order,pls pay by TT.

 

How about the shipping method?

We have stable cooperationship with DHL, Fedex, EMS, UPS, TNT and other air flight way or sea freight company.Usually we will quote you the most reasonable shipping method according to your country, good types, weight and requested delivery time.

We shall appreciate if you could write us details of your order quantity, country, sea port/air port before you send us inquiry. In this way we can offer you the best and most accurate price.

 

I am very satisfied after I read your information, how can I start to purchase my order?

Please click the "send" at the bottom of this page or contact our sales on Trade Manage online!

 

How to Contact Us? 

Would like to know more about the product? Send us inquiry, click "Send" now!

Pls feel free to send us gerber file and BOM list for lastest price and discount!



 

 

 

 

  

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