Customization: | Available |
---|---|
Type: | Rigid Flexible Circuit Board |
Flame Retardant Properties: | V0 |
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Materials |
Polyimide / FR4 |
Thinnest Core |
50um without Adhesive |
Copper Thickness |
9um / 12um / 18um / 35um |
Copper Plating Holes |
20um (25um) |
Min. Line / Spacing |
125um / 125um |
Soldermask Registration |
+/- 100um (Photoimageable) |
Min. Soldermask Dam |
100um |
Soldermask Color |
Amber (green) |
Cover Layer Polyimide |
Laser cutting / punching / drilled |
Production Panel |
609.6 mm x 457.2 mm 250 mm x (250 - 410 mm) |
Min. Annular Ring |
150um |
Smallest Drill |
0.28 mm |
Smallest Routing Bit |
0.8 mm |
Surfaces |
OSP / Immersion Tin Immersion Ni/Au Plated Ni/Au |
ID Print |
White |
Adhesive Tape |
Yes |
SMT Service |
Yes |
Stiffner Material |
FR4 / Steel / Aluminium |