Customization: | Available |
---|---|
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Number of Layers | 4 |
Board Type | Multilayer PCB |
Board Thickness | 1.00 mm +/-0.1 |
Board Material | RO5880 6.6mil, RO4350B 20mil |
Board Material Supplier | Rogers Corp |
Tg Value of Board Material | 280ºC |
PTH Cu thickness | ≥20 um (See hole wall details) |
Inner Iayer Cu thicknes | 1 oz (1.4mil) |
Surface Cu thickness | 1 oz (1.4mil) |
Solder Mask Type and Model No. | LP-4G/G-05 |
Solder Mask Supplier | NANYA |
Solder Mask Colour | Green |
Number of Solder Masks | 1 |
Thickness of Solder Mask | 15.3 um |
Type of Silkscreen Ink | S-380W |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | Whie |
Number of Silkscreen | 1 |
Mininum Trace (mil) | 5.0 mil |
Minimum Gap(mil) | 4.9 mil |
Surface Finish | Immersion Gold |
RoHS Required | Yes |
Warpage | 0.21% |
Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um | ||||
NO. | A | B | C | D | E | F | AVE |
1 | 22.800 | 22.300 | 23.700 | 23.700 | 22.300 | 24.500 | 23.000 |
2 | 27.000 | 22.300 | 22.500 | 22.500 | 22.500 | 22.600 | 23.600 |
3 | 23.000 | 22.300 | 27.000 | 27.000 | 22.300 | 22.800 | 23.400 |
NO. | Required Dimension (toerance) | Actual dimension | ||||
1 | 97.00 | ±0.15 | 97.02 | 97.01 | 97.01 | 97.02 |
2 | 100.00 | ±0.15 | 100.02 | 100.01 | 99.99 | 100.01 |
NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension | ||||
1 | 0.250 | ±0.076 | Y | via | via | via | via |
2 | 0.406 | ±0.076 | Y | via | via | via | via |
3 | 3.174 | ±0.076 | Y | 3.200 | 3.175 | 3.175 | 3.200 |
PCB capability and services: |
1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
4. Quantities range from sample to mass order |
5. 100% E-Test |
SMT(Surface Mounting technology),DIP. |
1. Material Sourcing Service |
2. SMT assembly and Through hole components insertion |
3.100% AOI testing |
4. IC pre-programming / Burning on-line |
5.ICT testing |
6.Function testing as requested |
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
8.Conformal coating |
9.OEM/ODM also welcomed |