High Quality Fr4 Multilayer Rogers PCB Board Prototype
Product Details
| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Year of Establishment
2006-09-21
Address
3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, ...
Plant Area
580 square meters
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Basic Info.
- Model NO.
- Fl9991
- Material
- Fiberglass Epoxy
- Application
- Communication
- Flame Retardant Properties
- V1
- Mechanical Rigid
- Rigid
- Processing Technology
- Electrolytic Foil
- Base Material
- Fr4
- Insulation Materials
- Epoxy Resin
- Brand
- Fastline
- Board Thickness
- 1.6mm
- Copper Thickness
- 1oz
- Material Type
- Fr4
- Surface Treatment
- HASL Lead Free
- Solder Mask
- Green, Red, Blue, Black
- Silk Screen Color
- White
- Board Layer
- 1-50
- Shipping Type
- DHL, UPS, TNT, EMS, FedEx etc
- Packing Type
- Carton + Vacumm
- Lead Time
- 5-7 Days
- Transport Package
- Vacuum+Carton Packing
- Specification
- RoHS, ISO9001, UL, SGS
- Trademark
- Fastline
- Origin
- Shenzhen, China
- HS Code
- 8534009000
- Production Capacity
- 20000 Square Meter/Mon
Packaging & Delivery
- Package Size
- 25.00cm * 35.00cm * 20.00cm
- Package Gross Weight
- 3.000kg
Product Description
Product Description
High Quality Fr4 Multilayer Rogers PCB Board Prototype
Commodity Introduction
This is a type of 4 layer high frequency circuit board at 1.0mm thick for the application of Radar RF. The base laminate is from RogersCorp RO5880 with prepreg RO5880.Green solder mask and White silkscreen on top side. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately. There're blind via from top to inner layer 1 which increase the difficulty of making the plate.
Parameters & Data Sheet
| Number of Layers | 4 |
| Board Type | Multilayer PCB |
| Board Thickness | 1.00 mm +/-0.1 |
| Board Material | RO5880 6.6mil, RO4350B 20mil |
| Board Material Supplier | Rogers Corp |
| Tg Value of Board Material | 280ºC |
| PTH Cu thickness | ≥20 um (See hole wall details) |
| Inner Iayer Cu thicknes | 1 oz (1.4mil) |
| Surface Cu thickness | 1 oz (1.4mil) |
| Solder Mask Type and Model No. | LP-4G/G-05 |
| Solder Mask Supplier | NANYA |
| Solder Mask Colour | Green |
| Number of Solder Masks | 1 |
| Thickness of Solder Mask | 15.3 um |
| Type of Silkscreen Ink | S-380W |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | Whie |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.0 mil |
| Minimum Gap(mil) | 4.9 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.21% |
| Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Microsection Hole Wall (um)
| Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um | ||||
| NO. | A | B | C | D | E | F | AVE |
| 1 | 22.800 | 22.300 | 23.700 | 23.700 | 22.300 | 24.500 | 23.000 |
| 2 | 27.000 | 22.300 | 22.500 | 22.500 | 22.500 | 22.600 | 23.600 |
| 3 | 23.000 | 22.300 | 27.000 | 27.000 | 22.300 | 22.800 | 23.400 |
Outline dimension Unit: mm
| NO. | Required Dimension (toerance) | Actual dimension | ||||
| 1 | 97.00 | ±0.15 | 97.02 | 97.01 | 97.01 | 97.02 |
| 2 | 100.00 | ±0.15 | 100.02 | 100.01 | 99.99 | 100.01 |
Hole Size and Slot Dimension (mm)
| NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension | ||||
| 1 | 0.250 | ±0.076 | Y | via | via | via | via |
| 2 | 0.406 | ±0.076 | Y | via | via | via | via |
| 3 | 3.174 | ±0.076 | Y | 3.200 | 3.175 | 3.175 | 3.200 |
Workshop:

Our service:
| PCB capability and services: |
| 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
| 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
| 3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
| 4. Quantities range from sample to mass order |
| 5. 100% E-Test |
| SMT(Surface Mounting technology),DIP. |
| 1. Material Sourcing Service |
| 2. SMT assembly and Through hole components insertion |
| 3.100% AOI testing |
| 4. IC pre-programming / Burning on-line |
| 5.ICT testing |
| 6.Function testing as requested |
| 7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
| 8.Conformal coating |
| 9.OEM/ODM also welcomed |
Contact us:
Web: fastlinepcb.en.made-in-china.com
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