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Flexible Printed Circuit Board (FPC) for Communication Devices, Enig Flexible Protoboard
Product Details
Structure:
Multilayer FPC
Material:
Polyimide
Combination Mode:
Without Adhesive Flexible Plate
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Precise Digital Duplicate
Angle Unlimited
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Product Description
Company Info.
Basic Info.
Model NO.
FL898
Application
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive
Conductive Silver Paste
Flame Retardant Properties
V1
Processing Technology
Enig
Base Material
Polyimide
Insulation Materials
Organic Resin
Board Material
Polyimide
Board Thickness
1.6 Mm
Copper Thickness
1 Oz (35um)
Surface Treatment
HASL Lead Free
Transport Package
Vacuum+Carton Packing
Specification
UL, SGS, ROHS
Trademark
FL
Origin
China
HS Code
8534009000
Production Capacity
20000 Square Meter/Mon
Product Description
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Fastline Circuits Co., Limited
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