Flexible Printed Circuit Board (FPC) for Communication Devices, Enig Flexible Protoboard

• Model NO.: FL898
• Processing Technology: Enig
• Base Material: Polyimide
• Insulation Materials: Organic Resin
• Brand: FPC
• Board Material: Polyimide
• Board Thickness: 1.6 Mm
• Copper Thickness: 1 Oz (35um)
• Surface Treatment: HASL Lead Free
• Transport Package: Vacuum+Carton Packing
• Specification: UL, SGS, ROHS
• Trademark: FL
• Origin: China
• HS Code: 8534009000
• Production Capacity: 20000 Square Meter/Mon

Product Description