Rigid Fr4 Printed Circuit Board with High Quality

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: FR-4
• Model NO.: Fl521
• Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate
• Application: Communication, Consumer Electronics
• Flame Retardant Properties: V1, V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Fr4, Copper
• Insulation Materials: Epoxy Resin, Organic Resin
• Brand: Fastline
• Type: Rigid Circuit Board
• Mechanical Rigid: Rigid
• Board Thickness: 1.6mm
• Copper Thickness: 1oz
• Material Type: Fr4
• Surface Treatment: HASL Lead Free
• Solder Mask: Green, Red, Blue, Black
• Silk Screen Color: White
• Board Layer: 1-50
• Shipping Type: DHL, UPS, TNT, EMS, FedEx etc
• Packing Type: Carton + Vacuum
• Lead Time: 5-7 Days
• Transport Package: Vacuum+Carton Packing
• Specification: RoHS, ISO9001, UL, SGS
• Trademark: Fastline
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000 Square Meter/Mon

Product Description

Product Description

Rigid Fr4 Printed Circuit Board with High Quality





Commodity Introduction

This is a type of High frequency FR4 PCB for the application of industry control. It's a
4 layer board at 1.6mm thick. The base laminate is from Rogers Corp. and ITEQ.  Solder mask
and silkscreen from Nanya and Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerb
-er data. Each 10 boards or panels are packed separately. 




Parameters & Data Sheet

PCB SIZE	102x 89mm=1PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 4 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	RO4003C 12mil Er 3.38
	copper ------- 18um(0.5oz) MidLayer 1
	FR-4 1.0mm
	copper ------- 18um(0.5oz) MidLayer 2
	RO4003C 12mil Er 3.38
	copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minimum / Maximum Holes:	0.3/0.5mm
Number of Different Holes:	3
Number of Drill Holes:	1521
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	Differential pairs impedance control, Layer 3 ,  4mil / 4mil , 91 ohm+/-10%,  Single trace  impedance control, Layer 4, 6mil, 49ohm+/-10%
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180 TG>170, er<5.4. RO4003C 12mil
Final foil external:	1.5oz
Final foil internal:	0.5oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold (21.5%) 2 micoinch over  100 microinch nickel
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and  leged FREE AREA
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	Balanced amplifier, Dsl Modems ADSL Router 3G Modem Gsm Alarm AC To DC Converter
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Microsection Hole Wall (um)

Hole Wall Cu Thickness			≥20 um	Hole Wall Cu Roughness			≤25.4 um
NO.	A	B	C	D	E	F	AVE
1	22.800	22.300	23.700	23.700	22.300	24.500	23.000
2	27.000	22.300	22.500	22.500	22.500	22.600	23.600
3	23.000	22.300	27.000	27.000	22.300	22.800	23.400

Outline dimension  Unit: mm

NO.	Required Dimension (toerance)		Actual dimension
1	97.00	±0.15	97.02	97.01	97.01	97.02
2	100.00	±0.15	100.02	100.01	99.99	100.01

Hole Size and Slot Dimension (mm)

NO.	Requerment Dimension (tolerance)		PTH/NPT	Actual dimension
1	0.250	±0.076	Y	via	via	via	via
2	0.406	±0.076	Y	via	via	via	via
3	3.174	±0.076	Y	3.200	3.175	3.175	3.200

Workshop:




Our service:
 

PCB capability and services:

1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, 
good quality  and excellent service.

2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. 

3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. 

4. Quantities range from sample to mass order

5. 100% E-Test 

 

SMT(Surface Mounting technology),DIP.

1. Material Sourcing Service

2. SMT assembly and Through hole components insertion

3.100% AOI testing

4. IC pre-programming / Burning on-line

5.ICT testing

6.Function testing as requested 

7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)

8.Conformal coating

9.OEM/ODM also welcomed

 
 
FAQ
 
Q1: What's your minimum order quantity?
A1: We do not have MOQ requirement, we can support your projects starting from prototypes to mass productions.
 
Q2: What file we should offer?
A2: For PCB: Gerber file is better, (Protel, power PCB, PADs file), for PCBA: Gerber file and BOM list.
 
Q3: What any other information should be offered except for file?
A3: Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen
f) Quantity
 
Q4: I am very satisfied after I read your information, how can I start to place my order?
A4: Please send us quotes on Made-in-China.