Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT |
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PCB Max. size | DIP capacity |
Min component size | 0201 |
Min.pin space of IC | 0.3mm |
Min. space of BGA | 0.3mm |
Max.precision of IC assembly | ±0.03mm |
SMT capacity | ≥2 million points/day |
DIP capacity | ≥100k parts/day |
SMT(Surface Mounting technology),DIP. |
1. Material Sourcing Service |
2. SMT assembly and Through hole components insertion |
3.100% AOI testing |
4. IC pre-programming / Burning on-line |
5.ICT testing |
6.Function testing as requested |
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
8.Conformal coating |
9.OEM/ODM also welcomed |