Customization: | Available |
---|---|
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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PCB SIZE | 201 x 69mm=1PCS |
BOARD TYPE | RO4350B Mixed FR-4 Hybrid Material |
Number of Layers | Multilayer PCB, 4 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
20 mil ROGERS 4350B | |
copper ------- 18um(0.5oz) | |
Pregpreg | |
copper ------- 18um(0.5oz) | |
28 mil FR-4 | |
copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 7.99mil/9.37mil |
Minimum / Maximum Holes: | 0.399mm/3.556mm |
Number of Different Holes: | 7 |
Number of Drill Holes: | 4511 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-140 TG>135, RO4350B 20mil |
Final foil external: | 1.5oz |
Final foil internal: | 0.5oz |
Final height of PCB: | 1.69mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (12.7%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Multiplexer, Wireless CCTV Tone Generator Bluetooth PC GPS Auto Bluetooth For PC |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
PCB capability and services: |
1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
4. Quantities range from sample to mass order |
5. 100% E-Test |
SMT(Surface Mounting technology),DIP. |
1. Material Sourcing Service |
2. SMT assembly and Through hole components insertion |
3.100% AOI testing |
4. IC pre-programming / Burning on-line |
5.ICT testing |
6.Function testing as requested |
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
8.Conformal coating |
9.OEM/ODM also welcomed |
Production Capacity | |
PCB Max. size | DIP capacity |
Min component size | 0201 |
Min.pin space of IC | 0.3mm |
Min. space of BGA | 0.3mm |
Max.precision of IC assembly | ±0.03mm |
SMT capacity | ≥2 million points/day |
DIP capacity | ≥100k parts/day |