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Multi-Layer Printed Circuit Board PCB Assembly Prototype Electronics Assembler pictures & photos

Multi-Layer Printed Circuit Board PCB Assembly Prototype Electronics Assembler

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Fastline Circuits Co., Limited

Gold Member Since 2013

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Product Description

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Basic Info.

Model NO.

L001

Small Orders

Accepted

Copper Thickness

1oz

Board Thickness

1.6mm

Lead Time

12-20days

Transport Package

Vacuum+Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000 Square Meter/Mon

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Fastline Circuits Co., Limited

Gold Member Since 2013

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Manufacturer/Factory

Registered Capital

5000000 RMB

Plant Area

>2000 square meters

Multi-Layer Printed Circuit Board PCB Assembly Prototype Electronics Assembler

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